The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2007
Filed:
Feb. 26, 2004
Fiber optic module packaging architecture for integrated circuit and optical subassembly integration
Jason Yorks, Longmont, CO (US);
William Kit Dean, Golden, CO (US);
Bob Arnold, Broomfield, CO (US);
Blake Mynatt, Broomfield, CO (US);
Jason Yorks, Longmont, CO (US);
William Kit Dean, Golden, CO (US);
Bob Arnold, Broomfield, CO (US);
Blake Mynatt, Broomfield, CO (US);
Optical Communication Products, Inc., Woodland Hills, CA (US);
Abstract
A fiber optic module that includes a packaged integrated circuit chip mounted on a top surface of a printed circuit or other mounting board is disclosed. The integrated circuit chip is electrically coupled to an optical subassembly (OSA) mounted along an edge of the printed circuit board and capable of emitting or receiving light traveling parallel to the printed circuit board. The packaged IC chip is electrically coupled to the OSA through at least one microwave via extending through the board and a conductive trace formed on the opposed bottom surface of the board.