The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2007

Filed:

Dec. 11, 2000
Applicants:

John J. Weisgerber, Whitmore Lake, MI (US);

Donald J. Svetkoff, Ann Arbor, MI (US);

Donald K. Rohrer, Whitmore Lake, MI (US);

Inventors:

John J. Weisgerber, Whitmore Lake, MI (US);

Donald J. Svetkoff, Ann Arbor, MI (US);

Donald K. Rohrer, Whitmore Lake, MI (US);

Assignee:

GSI Group, Inc., New Brunswick, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method and system are provided for inspecting electronic components mounted on printed circuit boards utilizing both 3-D and 2-D data associated with the components and the background on which they are mounted on the printed circuit board. Preferably, a 3-D scanner in the form of a solid state dual detector laser images the components and solder paste on the printed circuit board to obtain the 3-D and 2-D data. Then, a high speed image processor processes the 3-D data to find the locations of the leads and the solder paste. Then, the high speed image processor processes the 2-D data together with the locations of the leads and the solder paste to distinguish the leads from the solder paste. The high speed image processor may calculate centroids of feet of the leads, average height of the feet and border violation percentage of the solder paste.


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