The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2007
Filed:
Oct. 15, 2004
Applicants:
David M. Mahoney, Palo Alto, CA (US);
Mohsen Hossein Mardi, Fremont, CA (US);
Inventors:
David M. Mahoney, Palo Alto, CA (US);
Mohsen Hossein Mardi, Fremont, CA (US);
Assignee:
Xilinx, Inc., San Jose, CA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2006.01);
U.S. Cl.
CPC ...
Abstract
Die probing devices can include multiple sets of probe wires, where certain probe wires correspond to test pads and other correspond to bond pads. The probe wires can be electrically coupled to each other using either a space transformer or a probe card, to provide appropriate continuity. Probe wires can generally be arranged in numerous different patterns depending upon (for example) pad layout, wire configuration, wire type, and probe head design/manufacturing constraints.