The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2007
Filed:
Oct. 26, 2004
Applicant:
Yoshiharu Ogata, Sakata, JP;
Inventor:
Yoshiharu Ogata, Sakata, JP;
Assignee:
Seiko Epson Corporation, , JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of manufacturing a semiconductor device is provided including depressing a bonding tool having a concave portion toward a wiring board with a semiconductor chip disposed within the concave portion, pressing the semiconductor chip with a bottom face of the concave portion, fluidizing a resin provided between the semiconductor chip and the wiring board, and filling a lateral space proximate the semiconductor chip within the concave portion with the resin, and curing the resin.
Ogata, Yoshiharu. (2007). Semiconductor device and its manufacturing method, and semiconductor device manufacturing system (U.S. Patent No. 7179687). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7179687
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile