The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2007

Filed:

Jul. 29, 2004
Applicants:

Yuji Kimura, Otsu, JP;

Takenobu Maeda, Omihachiman, JP;

Toru Kabe, Koka-gun, JP;

Inventors:

Yuji Kimura, Otsu, JP;

Takenobu Maeda, Omihachiman, JP;

Toru Kabe, Koka-gun, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/58 (2006.01);
U.S. Cl.
CPC ...
Abstract

A circuit element having electrodes on one main surface thereof and a substrate having connection bump electrodes and recognition bump electrodes provided on one main surface thereof are prepared. Connection bumps and recognition bumps are formed on the connection bump electrodes and the recognition bump electrodes by using a wire bonding method. Based on the images of the recognition bumps picked up by an optical device, the location of the recognition bumps is detected and, based on the detected location, the circuit element is connected to the substrate through the connection bumps. Since the upper portions of the recognition bumps are in a convex shape, a contrast with respect to the recognition bump electrodes is easily obtained and the location of the recognition bumps can be correctly detected.


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