The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2007
Filed:
Sep. 17, 2003
EE Hua Wong, Singapore, SG;
Ranjan Rajoo, Singapore, SG;
Wai Kwan Wong, Singapore, SG;
Mahadevan Krishna Iyer, Singapore, SG;
Ee Hua Wong, Singapore, SG;
Ranjan Rajoo, Singapore, SG;
Wai Kwan Wong, Singapore, SG;
Mahadevan Krishna Iyer, Singapore, SG;
Agency for Science, Technology and Research, Singapore, SG;
National Univeristy of Singapore, Singapore, SG;
Georgia Tech Research Corporation, Atlanta, GA (US);
Abstract
A method and device to elongate a solder joint are provided. The method begins by forming an elongator on a first substrate. The elongator comprises an expander and an encapsulant to encapsulate the expander. A solder joint is formed to connect the first substrate to a second substrate. Thereafter, the encapsulant is softened to release the expander from a compressed state to elongate the solder joint. The device to elongate a solder joint comprises a substrate having an elongator formed on it. The elongator includes an expander in a compressed state and an encapsulant to encapsulate the expander.