The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2007

Filed:

Oct. 18, 2004
Applicant:

David T. Schlenke, Janesville, WI (US);

Inventor:

David T. Schlenke, Janesville, WI (US);

Assignee:

SSI Technologies, Inc., Janesville, WI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/053 (2006.01);
U.S. Cl.
CPC ...
Abstract

An apparatus and method for producing a substantially uniform bond line thickness by utilizing a crosshatch, grid pattern, or spacers of like patterns in a receptacle of a transducer housing. Certain embodiments include a housing configured to retain a transducer. The housing includes an annular wall and a receptacle adjacent to the wall. The receptacle has a member configured to allow radiation to pass through it. The member has a first surface and a second surface. The spacers on the first surface are configured in a grid pattern to maintain uniform spacing and a uniform bond line thickness between the transducer and the member. The bond line is further controlled by the depth of the spacers, which are configured to maintain a generally constant bond line thickness.


Find Patent Forward Citations

Loading…