The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2007
Filed:
Oct. 26, 2005
Hans Evald Goran Martin, Delsbo, SE;
Klas Anders Hjort, Uppsala, SE;
Mikael Peter Erik Lindberg, Uppsala, SE;
Hans Evald Goran Martin, Delsbo, SE;
Klas Anders Hjort, Uppsala, SE;
Mikael Peter Erik Lindberg, Uppsala, SE;
Senseair AB, Delsbo, SE;
Abstract
The present invention comprises a processed thin film substrate () and a method therefore, in order to produce a flexible printed circuit card, having a plurality of microvias going or passing through the thin film substrate and electrically connected along faced-away surfaces, in order to form an electric circuit. A first a number of real nano-tracks are filled with a first material (M), having good electric properties, for the formation of a first number of, here denominated, first vias (V, V, V), that a second number of real nano-tracks are filled with a second material (M), having good electric properties, for the formation of a second number of, here denominated, second vias (V, V, V). The first material (M) and the second material (M) of said first and second vias (V–V) are chosen having mutually different thermoelectric properties. A material surface-applied to the thin film substrate, coated on both sides () of the thin film substrate (), is distributed and/or adapted in order to allow the electrical interconnection of first vias, allocated the first material (M), with second vias, allocated the second material (M), and that a first via (V) included in a series connection and a last via (V) included in the series connection are serially co-ordinated in order to form an electric thermocouple () or other circuit arrangement.