The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2007
Filed:
Mar. 07, 2002
Wolfgang Schulz, Langerwehe, DE;
Jan Michel, Aachen, DE;
Peter Abels, Alsdorf, DE;
Gerhard Alber, Ravensburg, DE;
Jörg Neubert, Heilbronn, DE;
Friedrich Behr, Aachen, DE;
Stefan Kaierle, Herzogenrath, DE;
Wolfgang Schulz, Langerwehe, DE;
Jan Michel, Aachen, DE;
Peter Abels, Alsdorf, DE;
Gerhard Alber, Ravensburg, DE;
Jörg Neubert, Heilbronn, DE;
Friedrich Behr, Aachen, DE;
Stefan Kaierle, Herzogenrath, DE;
Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V., München, DE;
Thyssen Laser-Technik GmbH, Aachen, DE;
ThyssenKrupp Drauz Nothelfer GmbH, Heilbronn, DE;
Abstract
In a method for cutting structural components to be joined by laser radiation that is guided by a computer-controlled manipulation system provided with a nominal path for each structural component corresponding to a joining line that is curved as a result of at least one of the structural components being three-dimensionally shaped, the structural component surfaces of the structural components including the joining line are determined measuring technologically. Based on measuring results, the nominal path corresponding to a penetration line of the structural components to be joined is calculated. A marking is formed on a first one of the structural component surfaces. When performing the cut on the structural component surface provided with the marking, the resulting cutting gap and the marking are determining measuring technologically. When a deviation of the cutting gap from the nominal path is detected, the manipulation system is controlled to correct the deviation.