The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2007
Filed:
Nov. 19, 2004
Kazuhiko Tanabe, Kanagawa, JP;
Hiroaki Terada, Toyama, JP;
Masahiro Sugiura, Aichi, JP;
Tetsuharu Mizutani, Aichi, JP;
Keiichiro Imamura, Kanagawa, JP;
Takashi Tanaka, Osaka, JP;
Kazuhiko Tanabe, Kanagawa, JP;
Hiroaki Terada, Toyama, JP;
Masahiro Sugiura, Aichi, JP;
Tetsuharu Mizutani, Aichi, JP;
Keiichiro Imamura, Kanagawa, JP;
Takashi Tanaka, Osaka, JP;
NEC Infrontia Corporation, Kanagawa, JP;
NEC Toppan Circuit Solutions Toyama, Inc., Toyama, JP;
Soldercoat Co., Ltd., Aichi, JP;
Maruya Seisakusho Co. Ltd., Aichi, JP;
Nihon Den-netsu Keiki Co., Ltd., Tokyo, JP;
Abstract
In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated through hole, a solder layer containing tin and zinc as main components is formed on the surfaces of the land through hole by a HAL treatment. The lead terminal is inserted and mounted in the through hole. The printed wiring board is brought into contact with jet flows of a solder containing tin and zinc as the main components to thereby supply a solder to the land and through hole.