The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2007
Filed:
Feb. 25, 2004
Hakuo Kataoka, Tokyo, JP;
Keizo Kawamura, Tokyo, JP;
Akitoshi Wagawa, Tokyo, JP;
Taiyo Yuden Co., Ltd., Tokyo, JP;
Abstract
To provide a ceramic composition and a ceramic wiring board that can be formed by the firing at a low temperature of 1,000° C. or less, has high strength and is advantageous when electronic component regions utilizing a ceramic layer are formed thereon. A raw ceramic material or calcined powder thereof having a composition consisting of 100 parts by mass of a main component that consists of 52 to 62% by mass of SiO, 12 to 22% by mass of MgO, and 21 to 32% by mass of CaO and 0.5 to 3 parts by mass of a boron component in terms of the oxide form is molded and fired to obtain a ceramic composition that contains a diopside crystal as a primary crystal. By forming a wiring layer with conductive material on a substrate made of the ceramic composition, a ceramic wiring board is obtained.