The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2007
Filed:
Oct. 15, 2004
Bryan J. Zart, Shakopee, MN (US);
Brian R. Burwick, Guentersville, AL (US);
Andrew J. Ries, Lino Lakes, MN (US);
John E. Nicholson, Blaine, MN (US);
Jay Lahti, Apple Valley, MN (US);
Gregory A. Theis, St. Joseph, WI (US);
Bryan J. Zart, Shakopee, MN (US);
Brian R. Burwick, Guentersville, AL (US);
Andrew J. Ries, Lino Lakes, MN (US);
John E. Nicholson, Blaine, MN (US);
Jay Lahti, Apple Valley, MN (US);
Gregory A. Theis, St. Joseph, WI (US);
Medtronic, Inc., Minneapolis, MN (US);
Abstract
A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. The core assembly is positioned into a second-shot mold assembly, and a second thermoplastic material is injected into the mold so that the second thermoplastic material extends over and adheres to the core portion and the circuit component.