The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2007
Filed:
Sep. 23, 2005
Hiroyuki Iwamoto, Mita, JP;
Akihito Yamane, Amagasaki, JP;
Tooru Egoshi, Kainan, JP;
Kenichi Sasaki, Wakayama, JP;
Hiroyuki Iwamoto, Mita, JP;
Akihito Yamane, Amagasaki, JP;
Tooru Egoshi, Kainan, JP;
Kenichi Sasaki, Wakayama, JP;
Sumitomo Metal Industries, Ltd., Osaka, JP;
Abstract
When manufacturing a seamless pipe by carrying out elongation rolling and sizing on a mother tube for forming a seamless pipe, the occurrence of portions of thickness variation in the seamless pipe is suppressed by previously identifying the portions of wall thickness variation where the thickness varies in the circumferential direction of the seamless pipe, and carrying out elongation rolling so that the thickness of the portions of the mother tube corresponding to the portions of wall thickness variation of the seamless pipe are different in thickness at the completion of elongation rolling from that of other portions of the mother tube. As a result, local variations in wall thickness in the circumferential direction of a seamless pipe are prevented.