The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2007
Filed:
Aug. 16, 2004
Binling Zhou, Tucson, AZ (US);
James L. Todsen, Tucson, AZ (US);
Brian D. Johnson, Tucson, AZ (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A bottom die and a top die stacked on the bottom die are configured to provide a daisy chain function. Both die include an input/output function control bonding pad (G), a first bonding pad (C) controllable to function as either an input or an output, and a second bonding pad (E) controllable to function as either an output or an electrically floating pad in response to a corresponding input/output function control signal. The top die () is stacked on the bottom die () and the first bonding pad (C) of the bottom die () is wire bonded to the first bonding pad (C) of the top die (). A first reference voltage (VDD) on the function control bonding pad of the bottom die configures its first bonding pad as an output and its second bonding pad as electrically floating, and a second reference voltage (VSS) on the function control bonding pad of the top die configures its first bonding pad as an input and its second bonding pad as an output, to thereby provide the daisy chain function.