The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2007
Filed:
Aug. 26, 2004
Shigeji Matsubara, Hirakata, JP;
Masaharu Yamamoto, Osaka, JP;
Toshiaki Fukusako, Kagoshima, JP;
Yoshito Tagashira, Izumi, JP;
Shigeji Matsubara, Hirakata, JP;
Masaharu Yamamoto, Osaka, JP;
Toshiaki Fukusako, Kagoshima, JP;
Yoshito Tagashira, Izumi, JP;
Neomax Materials Co., Ltd., Osaka, JP;
Abstract
A hermetic sealing cap member capable of suppressing deterioration of characteristics of an electronic component resulting from a sealant such as solder coming into contact with the electronic component in a package is obtained. This hermetic sealing cap, which is a hermetic sealing cap employed for an electronic component storing package for storing an electronic component (), comprises a hermetic sealing cap member (), a first plating layer () formed at least on a region other than a region of the hermetic sealing cap member formed with a sealant () and a second plating layer (), formed on the region of the hermetic sealing cap member on which the sealant is arranged, containing a material superior in wettability with the sealant to the first plating layer.