The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2007

Filed:

Feb. 02, 2005
Applicants:

Junji Sato, Niiza, JP;

Koji Otsuka, Niiza, JP;

Tetsuji Moku, Niiza, JP;

Takashi Kato, Niiza, JP;

Arei Niwa, Niiza, JP;

Yasuhiro Kamii, Niiza, JP;

Inventors:

Junji Sato, Niiza, JP;

Koji Otsuka, Niiza, JP;

Tetsuji Moku, Niiza, JP;

Takashi Kato, Niiza, JP;

Arei Niwa, Niiza, JP;

Yasuhiro Kamii, Niiza, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/62 (2006.01);
U.S. Cl.
CPC ...
Abstract

An overvoltage-proof light-emitting diode has a lamination of light-generating semiconductor layers on a first major surface of a silicon substrate. A front electrode in the form of a bonding pad is mounted centrally atop the light-generating semiconductor layers whereas a back electrode covers a second major surface of the substrate. An overvoltage protector, of which several different forms are disclosed, is disposed between the bonding pad and the second major surface of the substrate. The bonding pad and back electrode serves as electrodes for both LED and overvoltage protector. As seen from above the device, or in a direction normal to the first major surface of the substrate, the overvoltage protector lies substantially wholly beneath the bonding pad.


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