The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2007
Filed:
Mar. 31, 2003
William Louis Brodsky, Binghamton, NY (US);
Mark Kenneth Hoffmeyer, Rochester, MN (US);
James R. Stack, Endicott, NY (US);
William Louis Brodsky, Binghamton, NY (US);
Mark Kenneth Hoffmeyer, Rochester, MN (US);
James R. Stack, Endicott, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method and structure are provided for implementing enhanced interconnection performance of an electrical connector, such as a land grid array (LGA) module, and a printed wiring board. A multi-layer printed wiring board includes a plurality of predefined ground and power layers. At least one of the predefined ground and power layers includes a thickness variation minimizing structure for minimizing thickness variation. The thickness variation minimizing structure includes a perforated pattern within a selected area of the at least one of the predefined ground and power layers. The selected area is proximate to predefined module sites, such as land grid array (LGA) module sites, in the ground and power layers. The selected area can include regions surrounding each predefined module site, and also can include a region within the module site.