The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2007
Filed:
Feb. 18, 2004
Joaquin Torres, Saint-Martin-le-Vinoux, FR;
Vincent Arnal, Grenoble, FR;
Laurent Gosset, Grenoble, FR;
Joaquin Torres, Saint-Martin-le-Vinoux, FR;
Vincent Arnal, Grenoble, FR;
Laurent Gosset, Grenoble, FR;
STMicroelectronics SA, Montrouge, FR;
Koninklijke Philips Electronics N.V., Eindhoven, NL;
Abstract
A process for fabricating an integrated electronic circuit comprises the formation of at least one air gap between interconnect elements above only a defined portion of a surface of a substrate, within an interconnect layer. The interconnect layer comprises a sacrificial material and extends beneath an intermediate layer of permeable material. The air gap is formed by removal, through the intermediate layer, of at least part of the sacrificial material by bringing the permeable material into contact with an agent for removing the sacrificial material, to which agent the permeable material is resistant.