The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2007

Filed:

May. 20, 2004
Applicants:

Kazuaki Inukai, Ibaragi, JP;

Atsushi Matsushita, Nagasaki, JP;

Inventors:

Kazuaki Inukai, Ibaragi, JP;

Atsushi Matsushita, Nagasaki, JP;

Assignee:

Rohm Co., Ltd., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract

After forming a stopper film on a semiconductor substrate having a copper wiring layer therein, an interlayer insulating film made of a low dielectric constant material is formed on the stopper film. Then, after forming a capping film on the interlayer insulating film, a resist film having a predetermined pattern is formed on the capping film. The capping film and the interlayer insulating film are etched using the resist film as a mask to form an opening reaching the stopper film. After that, the stopper film exposed by the opening is etched, with the resist film left in place, to form a via hole. Then, the resist film is removed by ashing.


Find Patent Forward Citations

Inukai, Kazuaki. (2007). Method for manufacturing semiconductor device (U.S. Patent No. 7172965). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7172965

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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