The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7172958 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 06, 2007

Filed:

Feb. 02, 2005
Applicant:

Yorihiko Sasaki, Miyagi-ken, JP;

Inventor:

Yorihiko Sasaki, Miyagi-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/50 (2006.01); H01L 21/469 (2006.01);
U.S. Cl.
CPC ...
Abstract

A high-frequency wiring structure includes a microstrip line having a ground conductor, a dielectric disposed on the ground conductor, and a transmission conductor that is at least partially disposed in the dielectric. The transmission conductor is defined by a flat bottom parallel to the ground conductor, a pair of flat sides that are perpendicular to the ground conductor and are positioned on both sides of the flat bottom in the wiring width direction, and curved parts that continuously join the flat bottom and the pair of flat sides. The curved parts have a radius of curvature within the range of 5% to 50% of the thickness of the transmission conductor.


Find Patent Forward Citations

Sasaki, Yorihiko. (2007). High-frequency wiring structure and method for producing the same (U.S. Patent No. 7172958). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7172958

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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