The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2007

Filed:

Feb. 04, 2004
Applicants:

Kenji Sato, Kodaira, JP;

Yoshinori Iwabuchi, Kodaira, JP;

Masato Yoshikawa, Kodaira, JP;

Inventors:

Kenji Sato, Kodaira, JP;

Yoshinori Iwabuchi, Kodaira, JP;

Masato Yoshikawa, Kodaira, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed is a process for producing a rubber-based composite material, including the steps of forming, by sputtering, an adhesion film on a substrate to be mated with a rubber for constituting the composite material, laminating a rubber composition on the adhesion film, and vulcanizing the rubber composition, the sputtering is conducted by using a first target and a second target, composed of different metallic components and provided in a chamber, while moving the substrate in sputtering atmospheres formed by applying electric power simultaneously to the first and second targets. Also disclosed is a process for producing a rubber-based composite material, including the steps of forming, by sputtering, an adhesion film on a substrate to be mated with a rubber for constituting the composite material, laminating a rubber composition on the adhesion film, and vulcanizing the rubber composition, wherein the sputtering is conducted by using a plurality of targets, composed of metals or metallic compounds containing different metallic elements and provided in a chamber, while rotating the substrate in sputtering atmospheres formed by applying electric power simultaneously to the targets.


Find Patent Forward Citations

Loading…