The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2007

Filed:

Jan. 31, 2003
Applicants:

Masaharu Ito, Tokyo, JP;

Kenichi Maruhashi, Tokyo, JP;

Keiichi Ohata, Tokyo, JP;

Inventors:

Masaharu Ito, Tokyo, JP;

Kenichi Maruhashi, Tokyo, JP;

Keiichi Ohata, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 1/208 (2006.01); H01P 3/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

A conductive layer is formed on each of the upper and lower surfaces of a dielectric substrate, and the two conductive layers are connected by rows of via-holes that are formed which a spacing that is less than or equal to ½ of the wavelength in the dielectric substrate in the resonance frequency, whereby n stages of dielectric resonators and input/output waveguide structures are formed. If the number n of stages is assumed to be 3, the first-stage resonator and the second-stage resonator are coupled by an electromagnetic field by means of via-holes of a first spacing; the second-stage resonator and the third-stage resonator are coupled by an electromagnetic by means of via-holes of a second spacing, whereby a filter is formed. The input/output waveguide structure and the filter are coupled by an electromagnetic by means of via-holes of a fourth spacing. The first-stage resonator and the third-stage resonator are coupled by an electromagnetic field by means of via-holes of a third spacing.


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