The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2007

Filed:

Aug. 19, 2003
Applicants:

Takashi Mihara, Izumiotsu, JP;

Shouji Imamura, Sakura, JP;

Masao Kamikura, Sakura, JP;

Inventors:

Takashi Mihara, Izumiotsu, JP;

Shouji Imamura, Sakura, JP;

Masao Kamikura, Sakura, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 63/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A molding resin formed from a block copolymer comprising polyhydroxycarboxylic acid structural units (I), and polyester structural units (II) derived from a dicarboxylic acid and a diol; wherein the weight ratio (I)/(II) between the polyhydroxycarboxylic acid structural units (I) and the polyester structural units (II) is within a range from 95/5 to 10/90; the resin has a microphase separated structure in which either the polyhydroxycarboxylic acid structural units (I) or the polyester structural units (II) forms domains within a matrix formed by the other structural units; the average domain size of the domains is within a range from 0.08 to 5.0 μm; and the weight average molecular weight of the molding resin is within a range from 10,000 to 400,000.


Find Patent Forward Citations

Loading…