The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2007
Filed:
Dec. 04, 2002
Takahisa Aoyama, Settsu, JP;
Katsuhide Ohtani, Settsu, JP;
Hitoshi Imamura, Settsu, JP;
Tetsuo Shimizu, Settsu, JP;
Takahisa Aoyama, Settsu, JP;
Katsuhide Ohtani, Settsu, JP;
Hitoshi Imamura, Settsu, JP;
Tetsuo Shimizu, Settsu, JP;
Daikin Industries, Ltd., Osaka, JP;
Abstract
Highly ozone-resistant molding/shaped articles inclusive of piping materials and joints for use in semiconductor production lines, molding materials for ozone-resistant molding/shaped articles which are suited for the production of the molding/shaped articles, and ozone-resistant injection-molded articles and relevant injection-molding materials. Also disclosed is a molding material for ozone-resistant molding/shaped articles including a copolymer (A) and having a melt flow rate of 0.1–50 g/10 minute. The copolymer (A) is a copolymer including tetrafluoroethylene and a perfluorovinylether, and has not less than 3.5 mass % of a perfluorovinylether unit, a melting point of not less than 295° C., and not more than 50 of unstable terminal groups per 1×10carbon atoms in the copolymer (A).