The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2007
Filed:
Mar. 25, 2004
Kazuaki Sumita, Gunma-ken, JP;
Kaoru Katoh, Gunma-ken, JP;
Tokue Kojima, Gunma-ken, JP;
Toshio Shiobara, Gunma-ken, JP;
Kazuaki Sumita, Gunma-ken, JP;
Kaoru Katoh, Gunma-ken, JP;
Tokue Kojima, Gunma-ken, JP;
Toshio Shiobara, Gunma-ken, JP;
Shin-Estu Chemical Co., Ltd., Tokyo, JP;
Abstract
A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) an aromatic amine curing agent comprising 5–100% by weight of a specific aromatic amine compound having a purity of at least 99%, (C) an inorganic filler, and (D) an ester organic solvent having a boiling point of 130–250° C. is useful for semiconductor encapsulation. The composition has an infiltration ability, adhesion to silicon chips, resistance to deterioration under hot humid conditions, and resistance to thermal shocks.