The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2007
Filed:
Dec. 13, 2004
Duck Young Maeng, Chungcheongbuk-do, KR;
Byung Kook Sun, Seoul, KR;
Tae Hoon Kim, Daejeon, KR;
Jee Soo Mok, Chungcheongbuk-do, KR;
Jong Suk Bae, Busan, KR;
Yoong OH, Chungcheongnam-do, KR;
Chang-kyu Song, Daejeon, KR;
Suk-hyeon Cho, Daejeon, KR;
Duck Young Maeng, Chungcheongbuk-do, KR;
Byung Kook Sun, Seoul, KR;
Tae Hoon Kim, Daejeon, KR;
Jee Soo Mok, Chungcheongbuk-do, KR;
Jong Suk Bae, Busan, KR;
Yoong Oh, Chungcheongnam-do, KR;
Chang-Kyu Song, Daejeon, KR;
Suk-Hyeon Cho, Daejeon, KR;
Samsung Electro-Mechanics Co., Ltd., Kyunggi-Do, KR;
Abstract
Disclosed herein is a method of manufacturing a package substrate with a fine circuit pattern using anodic oxidation. By anodizing a metal core which is opened through a masking process, oxidation layers are formed in open areas of the metal core to insulate portions of circuit pattern from each other. Further, by electroplating portions provided between the oxidation layers with copper or filling conductive paste between the oxidation layers using a screen, a package substrate having a fine circuit pattern is achieved.