The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2007

Filed:

Jul. 01, 2004
Applicants:

Fengyan Zhang, Vancouver, WA (US);

Lisa H. Stecker, Vancouver, WA (US);

Bruce D. Ulrich, Beaverton, OR (US);

Sheng Teng Hsu, Camas, WA (US);

Inventors:

Fengyan Zhang, Vancouver, WA (US);

Lisa H. Stecker, Vancouver, WA (US);

Bruce D. Ulrich, Beaverton, OR (US);

Sheng Teng Hsu, Camas, WA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/06 (2006.01); H01L 21/461 (2006.01);
U.S. Cl.
CPC ...
Abstract

A one-mask etching method for use with a PCMO-containing RRAM to reduce stack side-wall residuals, includes preparing a substrate, taken from the group of substrates consisting of silicon, silicon dioxide and polysilicon; depositing a bottom electrode on the substrate; depositing a PCMO layer on the bottom electrode; depositing a top electrode on the PCMO layer; depositing a hard mask on the top electrode; depositing and patterning a photoresist layer on the hard mask; etching the hard mask; etching the top electrode using a first etching process having an etching atmosphere consisting of Ar, O, and Cl; etching the PCMO layer using an etching process taken from the group of etching processes consisting of the first etching process and a second etching process having an etching atmosphere consisting of Ar and O. etching the bottom electrode using the first etching process; and completing the RRAM device.


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