The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2007
Filed:
Feb. 05, 2004
Applicant:
Tsuyoshi Honda, Gunma-ken, JP;
Inventor:
Tsuyoshi Honda, Gunma-ken, JP;
Assignee:
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/38 (2006.01); H01L 21/56 (2006.01); C08L 63/00 (2006.01); C08L 83/04 (2006.01);
U.S. Cl.
CPC ...
Abstract
An epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, and (D) an effective flux component selected from among abietic acid, palustric acid, levopimaric acid and dihydroabietic acid is low volatile and exhibits improved wetting and adherent properties to solder balls. The epoxy resin composition is used to cover and encapsulate a semiconductor chip, especially as no-flow underfill material, forming a highly reliable semiconductor device.