The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2007
Filed:
Oct. 10, 2003
Applicants:
Takehiko Hiruma, Yamagata, JP;
Yasuhiko Akao, Yamagata, JP;
Teruo Fujiwara, Yamagata, JP;
Nobuhiro Nakamura, Kanagawa, JP;
Inventors:
Takehiko Hiruma, Yamagata, JP;
Yasuhiko Akao, Yamagata, JP;
Teruo Fujiwara, Yamagata, JP;
Nobuhiro Nakamura, Kanagawa, JP;
Assignee:
Asahi Glass Company, Limited, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B32B 9/00 (2006.01); H01L 51/50 (2006.01);
U.S. Cl.
CPC ...
Abstract
A laminate for forming a substrate with wires, comprising a conductive layer containing Al or an Al alloy as the major component, formed on a substrate and a capping layer containing a Ni—Mo alloy as the major component, formed on the conductive layer, a substrate with wires produced by etching the laminate to remove an unnecessary metal, and a method for producing the same.