The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2007

Filed:

Feb. 23, 2004
Applicants:

Daisuke Imanari, Tochigi, JP;

Masayasu Okuda, Tochigi, JP;

Naochika Kogure, Tochigi-ken, JP;

Masato Naito, Tochigi-ken, JP;

Inventors:

Daisuke Imanari, Tochigi, JP;

Masayasu Okuda, Tochigi, JP;

Naochika Kogure, Tochigi-ken, JP;

Masato Naito, Tochigi-ken, JP;

Assignee:

JSP Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 44/02 (2006.01); B29C 44/06 (2006.01); B29C 49/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided is a method for manufacturing a foam-molded article by molding between molds a parison with a foam layer formed by extruding an expandable molten resin composition, obtained by melt-kneading a polyethylene resin and a physical foaming agent, to an area of low pressure from a die, wherein the polyethylene resin is selected from those having a melt flow rate of 0.1 to 25 g/10 minutes and a melt tension of not less than 1.5 cN, and wherein the apparent density of the foam layer in the foam-molded article is about 0.04 to 0.3 g/cm.


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