The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2007
Filed:
Jan. 25, 2006
Applicants:
Andrew H. Barada, Portola Valley, CA (US);
Takehiko Ueda, Kanagawa-ken, JP;
Inventors:
Andrew H. Barada, Portola Valley, CA (US);
Takehiko Ueda, Kanagawa-ken, JP;
Assignee:
Nikon Corporation, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 49/12 (2006.01);
U.S. Cl.
CPC ...
Abstract
Methods and apparatus for substantially continuously measuring the surface of a wafer during a polishing process are disclosed. According to one aspect of the present invention, an apparatus includes a wafer support table that supports a wafer, a polishing pad that polishes a surface of the wafer, and a polishing pad structure that rotates the polishing pad over the surface of the wafer. The apparatus also includes a measuring device which is capable of continuously measuring the surface of the wafer during polishing of the surface of the wafer.