The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2007

Filed:

May. 14, 2004
Applicants:

Mamoru Miyashita, Saitama, JP;

Hiroki Ohta, Saitama, JP;

Inventors:

Mamoru Miyashita, Saitama, JP;

Hiroki Ohta, Saitama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/203 (2006.01); H01L 31/232 (2006.01);
U.S. Cl.
CPC ...
Abstract

A multilayer wiring board on which multiple components are overlappingly mounted. The multilayer wiring board includes: a first surface on which a first component among the multiple components is mounted; and a second surface whose height in a thickness direction of the multilayer wiring board is smaller than that of the first surface, by which a step is provided between the first surface and the second surface, a second component among the multiple components being mounted on the second surface to partially overlap the first component in a non-contact manner, the second surface also having a light-transmitting window through which light is transmitted.


Find Patent Forward Citations

Miyashita, Mamoru. (2007). Multilayer wiring board, method of mounting components, and image pick-up device (U.S. Patent No. 7167376). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7167376

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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