The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2007
Filed:
Oct. 20, 2004
Applicant:
Hiroyuki Hatano, Kyoto, JP;
Inventor:
Hiroyuki Hatano, Kyoto, JP;
Assignee:
Rohm Co., Ltd., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device increases the efficiency of the inductor having a three-dimensional spiral coil and increases the inductance value without requiring any special steps. The semiconductor device includes semiconductor elements and first, second and third metal wire layers to be used for the configuration of the semiconductor elements, a core disposed on the second metal wire layer, and a coil wherein a plurality of pieces of the first metal wire layer and a plurality of pieces of the third metal wire layer connected to the pieces via the connection holes are connected in series to define a spiral surrounding the core.