The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2007
Filed:
Jun. 03, 2005
Jay Gagnon, Holden, MA (US);
Richard Dickinson, Manchester, NH (US);
Michael C. Doogue, Manchester, NH (US);
Andreas P. Friedrich, Epagny, FR;
William P. Taylor, Amherst, NH (US);
Jay Gagnon, Holden, MA (US);
Richard Dickinson, Manchester, NH (US);
Michael C. Doogue, Manchester, NH (US);
Andreas P. Friedrich, Epagny, FR;
William P. Taylor, Amherst, NH (US);
Allegro Microsystems, Inc., Worcester, MA (US);
Abstract
An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and substrate having a first surface in which is disposed one or more magnetic field transducers, with the first surface being proximate the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit relative to a conventional orientation. A current conductor portion can be deposited proximate to a surface of the substrate and proximate to the one or more magnetic field sensors. With this arrangement, a current sensor is provided for which the one or more magnetic field transducers are very close to the current conductor portion, resulting in a current sensor having improved sensitivity. An insulating layer can be disposed between the current conductor portion and the substrate.