The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2007
Filed:
Dec. 19, 2001
Jan H Udding, Zwolle, NL;
Agnes E Wolters, Laag Zuthem, NL;
Heinz Wilhelm, Hassloch, DE;
Armin Pfeil, Kaufering, DE;
Thomas Bürgel, Landsberg, DE;
Lutz Sager, Scheuring, DE;
Jan H Udding, Zwolle, NL;
Agnes E Wolters, Laag Zuthem, NL;
Heinz Wilhelm, Hassloch, DE;
Armin Pfeil, Kaufering, DE;
Thomas Bürgel, Landsberg, DE;
Lutz Sager, Scheuring, DE;
DSM IP Assets B.V., Te Heerlen, NL;
Abstract
The invention relates to two-component chemical fastening systems, the A-component containing an unsaturated polyester and a reactive diluent, and the B-component containing a peroxide and an extender, wherein the extender is either a monomeric component according to formula 1(A—CH═CH—O)—R   (formula 1)or a resinous compound comprising, in a covalently built-in manner, a component having vinyl ether group(s), and the content of the peroxide in the B-component is from 0.5 to 99 wt. %. In the formula A, R and n are specified as hydrogen or Calkyl; C(hetero)-aliphatic with hydroxyl or amino groups, or poly(C)glycol with 2–120 glycol units; and 1 to 4, respectively. The resinous compounds with built-in vinyl ether group(s) (0.5 to 50 wt. %, calculated as indicated) are obtained by reaction of a mixture of appropriate amounts of: The invention also relates to methods for preparing (the B-component) of such two-component chemical fastening systems, as well as to use of the systems for chemical fastening.