The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7166487 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 23, 2007

Filed:

Nov. 08, 2004
Applicants:

Motoo Takada, Saitama, JP;

Kazumasa Adachi, Saitama, JP;

Inventors:

Motoo Takada, Saitama, JP;

Kazumasa Adachi, Saitama, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A first objective of the present invention is to provide a more productive method of manufacturing optical devices that minimizes processing distortion, maintains optical characteristics satisfactorily, and promotes smallness. A second objective thereof is to provide a method of manufacturing optical devices that prevents the occurrence of fine dust and maintains the optical characteristics satisfactorily. A third objective thereof is to provide a method of manufacturing optical devices of a multi-layer configuration that are obtained by applying a scribing/cutting method. A method of manufacturing optical devices in accordance with the present invention, wherein an optical wafer having surfaces polished to a mirror finish is divided into a plurality of optical chips, is provided with a first step of providing hairline cracks by a diamond blade edge in one main surface of the optical wafer and a third step of applying pressure along the hairline cracks after the first step, to divide the optical wafer into the plurality of optical chips.


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