The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2007
Filed:
Jul. 02, 2004
Chang-hyeon Nam, Kyunggi-do, KR;
Seung-kim Lee, Kyungki-do, KR;
Man-young Lee, Kyungki-do, KR;
Yoon-kyung Kim, Kyungki-do, KR;
Han-yong Chae, Kyungki-do, KR;
Duk-min Ahn, Kyungki-do, KR;
Chang-Hyeon Nam, Kyunggi-do, KR;
Seung-Kim Lee, Kyungki-do, KR;
Man-Young Lee, Kyungki-do, KR;
Yoon-Kyung Kim, Kyungki-do, KR;
Han-Yong Chae, Kyungki-do, KR;
Duk-Min Ahn, Kyungki-do, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
An apparatus for treating an edge of a semiconductor substrate includes an etchant supply nozzle for supplying a first etchant to the edge of the semiconductor substrate. The apparatus further includes a shielding cover for preventing an etchant from flowing to a shielding surface of the semiconductor substrate. The shielding cover is movable in an upward and downward direction. The apparatus also includes a device for cleaning the edge of the semiconductor substrate. According to the apparatus, after a wafer edge is etched, foreign substances remaining at the wafer edge is efficiently removed.