The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 2007

Filed:

Mar. 16, 2004
Applicants:

Hiroshi Yoshida, Kanagawa, JP;

Tadashi Taniguchi, Kanagawa, JP;

Takashi Mizuno, Miyagi, JP;

Inventors:

Hiroshi Yoshida, Kanagawa, JP;

Tadashi Taniguchi, Kanagawa, JP;

Takashi Mizuno, Miyagi, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A CAN package light emitting device comprises a semiconductor laserbonded on a sub mountand a CAN packagefor housing the semiconductor laserbonded on the sub mount. The CAN packagecomprises a fixing structurefor fixing the semiconductor laser at a predetermined position, and a capcovering the semiconductor laserfixed to the fixing structure. Vapor pressure of Si organic compound gas in the CAN packageis limited to or below 5.4×10N/mto prevent any deposit as thick as inviting characteristics deterioration from being formed on the light emitting portion of the semiconductor laserwithin the guaranteed time of its proper operation.


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