The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 2007

Filed:

Aug. 10, 2004
Applicants:

Takayuki Araki, Settsu, JP;

Tetsuhiro Kodani, Settsu, JP;

Takuji Ishikawa, Settsu, JP;

Inventors:

Takayuki Araki, Settsu, JP;

Tetsuhiro Kodani, Settsu, JP;

Takuji Ishikawa, Settsu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 8/32 (2006.01);
U.S. Cl.
CPC ...
Abstract

There is provided a method of forming a fine pattern by using a practicable fluorine-containing polymer which has a high transparency to exposure light having a short wavelength such as Flaser and can undergo resolution of a fine pattern. The method comprises (I) a step for preparing a fluorine-containing polymer (A) having OH group which has a structural unit derived from a fluorine-containing norbornene derivative having OH group, (II) a step for preparing a fluorine-containing polymer (B) having a protective group by reacting a compound represented by X—CHOR, wherein X is Cl, Br or I; R is a hydrocarbon group having 1 to 30 carbon atoms in which a part or the whole of hydrogen atoms may be substituted with fluorine atoms, with the above-mentioned fluorine-containing polymer (A) having OH group in the presence of a base, (III) a step for preparing a resist composition comprising (a) the above-mentioned fluorine-containing polymer (B) having a protective group, (b) a photoacid generator and (c) a solvent, (IV) a step for forming a resist film comprising the above-mentioned resist composition on a substrate or on a given layer on the substrate, (V) a step for exposing by selectively irradiating a given area of the resist film with energy rays, and (VI) a step for subjecting the exposed resist film to developing to selectively remove the exposed portion of the resist film, thus forming a fine pattern.


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