The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2007
Filed:
Apr. 23, 2001
Atsushi Tonai, Kitakyushu, JP;
Toshiharu Hirai, Kitakyushu, JP;
Tsuguo Koyanagi, Kitakyushu, JP;
Masayuki Matsuda, Kitakyushu, JP;
Michio Komatsu, Kitakyushu, JP;
Atsushi Tonai, Kitakyushu, JP;
Toshiharu Hirai, Kitakyushu, JP;
Tsuguo Koyanagi, Kitakyushu, JP;
Masayuki Matsuda, Kitakyushu, JP;
Michio Komatsu, Kitakyushu, JP;
Abstract
There is provided a process for producing an integrated circuit, wherein not only can conductive fine particles be deposited efficiently and densely in minute wiring channels and connecting holes but also a circuit of low wiring resistance and high density can be formed and wherein a high-degree integration can be achieved to thereby bring about an economic advantage. In particular, there is provided a process for producing an integrated circuit, comprising coating a substrate provided with wiring channels with a coating liquid for integrated circuit formation containing conductive fine particles to thereby form an integrated circuit on the substrate, wherein the coating liquid for integrated circuit formation while being exposed to ultrasonic waves is applied to the wiring channels.