The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2007
Filed:
Sep. 22, 2003
Noriyasu Sakai, Gunma, JP;
Yusuke Igarashi, Gunma, JP;
Masato Noguchi, Gunma, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Abstract
In order to prevent, in a resin sealing step, a conductive foilfrom locally rising because of concentration of air intervening between the conductive foiland lower moldA due to the charged pressure, a method for manufacturing circuit devices is provided. The method for manufacturing circuit devices includes the step of forming conductive patterns, which form a plurality of mounting portionsof a circuit elementon a conductive foil, in each block, the step of disposing the circuit elementon each mounting portionof the conductive patternin each block, the step of performing resin sealing by bringing the lower moldA having an air ventinto contact with the backface of the conductive foilin each blockand by performing transfer molding with an insulating resinwhile disposing each mounting portionof the blockin the same cavity, and the step of separating each mounting portionby dicing.