The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7163409 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 16, 2007

Filed:

Jul. 19, 2006
Applicants:

Wen-chun Chen, Tao Yuan, TW;

Ming-chih Huang, Tao Yuan, TW;

Inventors:

Wen-Chun Chen, Tao Yuan, TW;

Ming-Chih Huang, Tao Yuan, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 13/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

A modular integrated socket apparatus comprises a shell, a pop-up structure, an adapter module, a connector base, and a coupling device. The pop-up structure, the adapter module, the connector base, and the coupling device are mounted in the shell. The adapter module is electrically connected to the connector base. When in use, the shell and the adapter module are located higher than the table by use of the pop-up structure and the coupling device. As a result, the purpose of adding the connector of new hardware or power source can be achieved easily.


Find Patent Forward Citations

Chen, Wen-Chun. (2007). Modular integrated socket apparatus (U.S. Patent No. 7163409). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7163409

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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