The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2007
Filed:
Aug. 28, 2002
Makoto Miyazaki, Nagoya, JP;
Koji Okada, Nagoya, JP;
Makoto Miyazaki, Nagoya, JP;
Koji Okada, Nagoya, JP;
NGK Insulators, Ltd., Nagoya, JP;
Abstract
An extrusion die for extrusion molding of a honeycomb structure has back holes for introducing a raw material to be molded and slits for extruding the raw material. The extrusion die comprises an inside section, an outer peripheral section, and an outermost peripheral section; the width of the slitdisposed in the outer peripheral section is wider than the width of the slit disposed in the inside section; and when the surface roughness (Ra) of the slits in the inside section and the outer peripheral section is 0.1 μm or smaller, or when the surface roughness (Ra) of the slits in the inside section and the outer peripheral section exceeds 0.1 μm, the relationship between the surface roughness a of slit in the inside section and the surface roughness b of slit in the outer peripheral section satisfies the condition that 0.1<a/b<10.