The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2007

Filed:

Feb. 19, 2003
Applicants:

Hiroshi Higashitani, Habikino, JP;

Takeo Yasuho, Neyagawa, JP;

Masaaki Hayama, Nara, JP;

Inventors:

Hiroshi Higashitani, Habikino, JP;

Takeo Yasuho, Neyagawa, JP;

Masaaki Hayama, Nara, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A module component which includes circuit substratehaving one or more componentson at least one of the surfaces, and junction circuit substratehaving hollowor hole, disposed corresponding to the portion of the one or more componentsmounted on the one surface of circuit substratefor fitting the mounted componentsin. These substrates are laminated to form a single body so that mounted componentsis contained within the inside. The above configuration ensures high reliability in the layer-to-layer connection, and enables to mount a plurality of components densely with a high dimensional accuracy. Thus a highly reliable compact module component is offered.


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