The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2007

Filed:

Jun. 16, 2003
Applicants:

Michiaki Tsuneoka, Osaka, JP;

Koji Hashimoto, Hyogo, JP;

Masaaki Hayama, Nara, JP;

Takeo Yasuho, Osaka, JP;

Inventors:

Michiaki Tsuneoka, Osaka, JP;

Koji Hashimoto, Hyogo, JP;

Masaaki Hayama, Nara, JP;

Takeo Yasuho, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01);
U.S. Cl.
CPC ...
Abstract

A module includes a component, a circuit board having the component mounted thereon, a first grounding pattern formed on an outermost periphery of a surface portion of the circuit board; a first sealer provided on the circuit board and having a dimension projected on the circuit board, and a metal film covering the sealer and connected to the grounding pattern. The dimension of the first dealer is smaller than an outside dimension of the circuit board. The first sealer is made of first resin and sealing the component. The module has a low profile and is adequately shielded.


Find Patent Forward Citations

Quick Actions:

Tsuneoka, Michiaki. (2007). Module component (U.S. Patent No. 7161252). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7161252

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…