The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2007
Filed:
Apr. 18, 2005
Applicants:
Wai Yew Lo, Selangor, MY;
Cheng Choi Yong, Kul, MY;
Kong Bee Tiu, Selangor, MY;
Inventors:
Assignee:
Freescale Semiconductor, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of forming a substrateless semiconductor package () includes forming a carrier () on a base plate () and attaching an integrated circuit (IC) die () to the carrier (). The IC die () then is electrically connected to the carrier (). A molding operation is performed to encapsulate the IC die (), the electrical connections () and the carrier (). Thereafter, the base plate () is removed.