The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2007
Filed:
Aug. 26, 2002
Applicants:
Jürgen Leib, Freising, DE;
Florian Bieck, Mainz, DE;
Inventors:
Jürgen Leib, Freising, DE;
Florian Bieck, Mainz, DE;
Assignee:
Schott AG, Mainz, DE;
Primary Examiner:
Int. Cl.
CPC ...
B29D 11/00 (2006.01); H01B 13/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for producing an electronic component is provided. The method includes providing at least one die on a wafer, the at least one die having at least one sensor-technologically active and/or emitting device on at least a first side; producing at least one patterned support having at least one structure which is functional for the at least one sensor-technologically active and/or emitting device; joining the wafer with the at least one patterned support so that the first side faces the at least one patterned support; and separating the at least one die from the wafer.