The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2007
Filed:
Jun. 30, 2005
Syed Husain Abbas, Seymour, CT (US);
David John Lang, Southbury, CT (US);
Syed Husain Abbas, Seymour, CT (US);
David John Lang, Southbury, CT (US);
Conopco, Inc., Englewood Cliffs, NJ (US);
Abstract
A stress-release mold is described for casting thermosetting compositions especially compositions designed for consumer use. At least one wall of the mold includes a stress-releasing-element characterized by having a more flexible region or regions than the remaining wall or walls of the mold and wherein the stress-releasing-element includes a region of lower curvature at least partially surrounded by a region of higher curvature. The stress-release mold greatly reduces or eliminates surface defects caused by shrinkage of thermosetting compositions as they cools. A system is also described that includes the inventive mold containing a thermosetting composition wherein the mold also serves as all or part of the package for the composition.