The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2007

Filed:

Jun. 26, 2003
Applicants:

Stuart D. Downes, Milford, MA (US);

Larry Norris, Boston, MA (US);

Jin Liang, Southborough, MA (US);

Inventors:

Stuart D. Downes, Milford, MA (US);

Larry Norris, Boston, MA (US);

Jin Liang, Southborough, MA (US);

Assignee:

EMC Corporation, Hopkinton, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A circuit board processing system has a circuit board fabrication stage configured to fabricate a circuit board having a set of circuit board pads, and a solder fusing stage coupled to the circuit board fabrication stage. The solder fusing stage is configured to (i) apply flux and solder concurrently to the set of circuit board pads, and (ii) activate the flux and melt the solder to form a set of substantially flat solder coatings which is fused to the set of circuit board pads. The circuit board processing system further includes a washing stage coupled to the solder fusing stage. The washing stage is configured to remove contamination from a surface of the circuit board having the circuit board pads and from the set of substantially flat solder coatings which is fused to the set of circuit board pads. Such a system is well-suited for lead-free solder.


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