The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2007
Filed:
Jul. 31, 2002
Bruce Beauchamp, Gilbert, AZ (US);
Andrew Tuthill, Te Puke, NZ;
Joseph D. Fernandez, Nonthaburi, TH;
Anucha Phongsantichai, Bangkok, TH;
Bruce Beauchamp, Gilbert, AZ (US);
Andrew Tuthill, Te Puke, NZ;
Joseph D. Fernandez, Nonthaburi, TH;
Anucha Phongsantichai, Bangkok, TH;
Microchip Technology Inc., Chandler, AZ (US);
Abstract
An integrated circuit device comprising an integrated circuit die mounted on a leadframe having a plurality of inner leads. The integrated circuit die has a plurality of bond pads that are electrically connected to the inner leads of the leadframe, wherein at least two bond pads are connected to a one of the plurality of inner leads and/or at least two inner leads are connected to one or more bond pads with a single bond wire. A single bond wire is connected to a first bond pad or inner lead and subsequently wedge or stitch bonded to a second bond pad or inner lead, then it is connected to a third bond pad or inner lead. The single bond wire requires only one connection area at each of the bond pad(s) and inner lead(s). The bond pad(s) of the die and inner lead(s) of the leadframe are thereby electrically connected together by the single bond wire.